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Average Ratings 0 Ratings

Total
ease
features
design
support

No User Reviews. Be the first to provide a review:

Write a Review

Description

Ansys Sherlock stands out as the sole reliability physics-based tool for electronics design that delivers quick and precise life expectancy assessments for electronic components, boards, and systems during the initial design phases. By automating the design analysis process, Ansys Sherlock enables the rapid generation of life predictions, thus eliminating the "test-fail-fix-repeat" cycle that often hampers development. Designers can effectively model the interactions between silicon–metal layers, semiconductor packaging, printed circuit boards (PCBs), and assemblies, allowing for accurate predictions of potential failure risks stemming from thermal, mechanical, and manufacturing stresses, all prior to creating prototypes. Additionally, Sherlock's extensive libraries, which house over 500,000 components, facilitate the seamless transformation of electronic computer-aided design (ECAD) files into computational fluid dynamics (CFD) and finite element analysis (FEA) models. Each of these models is equipped with precise geometries and material properties, ensuring that stress information is accurately conveyed for reliable predictions. This capability not only enhances design efficiency but also significantly reduces the risk of costly errors in the later stages of product development.

Description

Easily perform electrical stress analysis, MTBF calculation, component derating, and FMECA analysis within your ECAD during board design. Key Features: • Uses cutting-edge AI technologies for robust and efficient design. *Seamless Integration with leading ECAD Software for streamlined workflows and real-time analyses. *Includes automated circuit strain calculators to speed up design processes. • Performs detailed analysis on electrical stress derivation for components. *Utilizes the results of thermal simulation to improve derating accuracy. *Provides thermal resistance and stress metrics for 3D Thermal Simulations. *Identifies EOS violations using Pareto analysis, and detailed reports on overstress and overdesign. *Recommends design changes to effectively resolve overstress problems. *Utilizes derating guidelines for optimal component performance. *Automates FMECA Analysis

API Access

Has API

API Access

Has API

Screenshots View All

Screenshots View All

No images available

Integrations

BQR
apmOptimizer

Integrations

BQR
apmOptimizer

Pricing Details

No price information available.
Free Trial
Free Version

Pricing Details

No price information available.
Free Trial
Free Version

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Vendor Details

Company Name

Ansys

Founded

1970

Country

United States

Website

www.ansys.com/products/structures/ansys-sherlock

Vendor Details

Company Name

BQR Reliability Engineering

Founded

1989

Website

www.bqr.com

Product Features

CFD

Computer-Aided Engineering (CAE)

CAD/CAM Compatibility
Finite Element Analysis
Fluid Dynamics
Import / Export Files
Integrated 3D Modeling
Manufacturing Process Simulation
Mechanical Event Simulation
Multibody Dynamics
Thermal Analysis

Alternatives

Alternatives

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